Processing of Photosensitive Polyimides for Packaging Applications
Authors:
- P. RickerlPRP. Rickerl
- J. StephanieJSJ. Stephanie
- P. SlotaPSP. Slota
- 1 December 1987
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 10 (4) , 690-694
Abstract
No abstract availableThis publication has 3 references indexed in Scilit:
- New Photosensitive High Temperature Polymers for Electronic ApplicationsJournal of Macromolecular Science: Part A - Chemistry, 1984
- Polyimide Cure Determination1984
- Rheological characterization of coatings with regard to application and film formationRheologica Acta, 1979