Low-temperature bonding of silicon/glass enabled by micro–nano-structures and nano-silver paste
- 20 November 2025
- journal article
- research article
- Published by Springer Nature in Journal of Materials Science: Materials in Electronics
- Vol. 36 (33) , 2108
Abstract
No abstract availableKeywords
Funding Information
- Excellent Young Scientists Program of Hunan Provincial Department of Education (23B0017)
- National Natural Science Foundation of China Joint Fund for Regional Innovation Development (U22A20200)
- Key Program for Basic Research (JCKY2023210A005)
- The National Key R&D Program of China (2023YFB4605500)
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