Thermal Interface Materials with High Adhesion and Enhanced Thermal Conductivity via Optimization of Polydimethylsiloxane Networks and Aluminum Fillers

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Funding Information
  • Youth Innovation Promotion Association of the Chinese Academy of Sciences (2019354)
  • National Natural Science Foundation of China (52303093, 62104244)
  • Shenzhen Science and Technology Innovation Program (JCYJ20220818101215033)
  • Shenzhen Hong Kong Joint Funding Project of Shenzhen Collaborative Innovation Technology Project (SGDX20230116092055009)

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