Interfacial bonding mechanism and fracture behavior in ultrasonic spot welding of copper sheets
Authors:
- Z.L. NiZNZ.L. Ni
- Y. LiuYLY. Liu
- Y.H. WangYWY.H. Wang
- B.Y. HeBHB.Y. He
- 1 January 2022
- journal article
- research article
- Published by Elsevier in Materials Science and Engineering: A
- Vol. 833
Abstract
No abstract availableKeywords
Funding Information
- National Natural Science Foundation of China (51905171)
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