Effect of rare earth element addition on the microstructure of Sn-Ag-Cu solder joint
Authors:
- 1 March 2005
- journal article
- Published by Springer Nature in Journal of Electronic Materials
- Vol. 34 (3) , 217-224
Abstract
No abstract availableKeywords
This publication has 3 references indexed in Scilit:
- Effects of intermetallic compounds on properties of Sn–Ag–Cu lead-free soldered jointsJournal of Alloys and Compounds, 2003
- Irreversible processes of spontaneous whisker growth in bimetallic Cu-Sn thin-film reactionsPhysical Review B, 1994
- The effect of Cu6Sn5 whisker precipitates in bulk 60sn-40pb solderJournal of Electronic Materials, 1987