Experiment and theoretical prediction for subsurface microcracks and damage depth of multi-crystalline silicon wafer in diamond wire sawing
Authors:
- Xinying LiXLXinying Li
- Yufei GaoYGYufei Gao
- Runtao LiuRLRuntao Liu
- Wei ZhouWZWei Zhou
- 19 March 2022
- journal article
- research article
- Published by Elsevier in Engineering Fracture Mechanics
- Vol. 266
Abstract
No abstract availableKeywords
Funding Information
- Key Technology Research and Development Program of Shandong Province (2020CXGC011003)
- National Natural Science Foundation of China (51875322)
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