A review on microchannel heat sinks: recent advancements, challenges, and future directions

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Abstract
The recent rapid miniaturization of modern electronic products, along with their increasing power density, has heightened the need for an efficient thermal management solution. Microchannel heat sinks have emerged as a promising technology due to their high heat removal capabilities and compact design, making them suitable for cooling next-generation electronics. This review presents the evolution from conventional air and liquid cooling methods to microchannel-based systems and discusses the governing flow and heat transfer mechanisms that influence their performance. A comparative assessment of single-phase and two-phase cooling highlights essential trade-offs involving heat transfer efficiency, operational stability, and system complexity. Recent advancements in micromachining and additive manufacturing have enabled the fabrication of complex 3D architectures for improved system integration. Although enhancements such as geometric optimization, nanofluids, and two-phase cooling demonstrate significant potential, challenges persist in flow instability, manufacturability, and long-term durability. Future research directions emphasize AI-driven design frameworks, sustainable working fluids, hybrid cooling approaches, and holistic performance–cost–environment optimization.

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