Micromachined passive phase-change cooler for thermal management of chip-level electronics
Authors:
- Hongyun SoHSHongyun So
- Albert P. PisanoAPAlbert P. Pisano
- 1 October 2015
- journal article
- Published by Elsevier in International Journal of Heat and Mass Transfer
- Vol. 89, 1164-1171
Abstract
No abstract availableKeywords
Funding Information
- Defense Advanced Research Projects Agency (HR0011-10-C-0100)
This publication has 36 references indexed in Scilit:
- Hierarchically structured surfaces for boiling critical heat flux enhancementApplied Physics Letters, 2013
- Thermal performance of flat vapor chamber heat spreaderEnergy Conversion and Management, 2008
- Towards a Thermal Moore's LawIEEE Transactions on Advanced Packaging, 2007
- Managing heat for electronicsMaterials Today, 2005
- Performance of different passive techniques for cooling of buildings in arid regionsBuilding and Environment, 2003
- Characterization of compact heat sink models in natural convectionIEEE Transactions on Components and Packaging Technologies, 2002
- MEMS-enabled thermal management of high-heat-flux devices EDIFICE: embedded droplet impingement for integrated cooling of electronicsExperimental Thermal and Fluid Science, 2001
- Cramming More Components Onto Integrated CircuitsProceedings of the IEEE, 1998
- Heat sinks with sloped plate fins in natural and forced convectionInternational Journal of Heat and Mass Transfer, 1996
- Radiative cooling efficiency of white pigmented paintsSolar Energy, 1993