Manufacturing costs for microsystems/MEMS using high aspect ratio microfabrication techniques
Author:
- 22 September 2006
- journal article
- Published by Springer Nature in Microsystem Technologies
- Vol. 13 (1) , 85-95
Abstract
No abstract availableKeywords
This publication has 11 references indexed in Scilit:
- Manufacturing tolerances for UV LIGA using SU-8 resistJournal of Micromechanics and Microengineering, 2005
- Fundamental limitations of LIGA x-ray lithography: sidewall offset, slope and minimum feature sizeJournal of Micromechanics and Microengineering, 2004
- Challenges, developments and applications of silicon deep reactive ion etchingMicroelectronic Engineering, 2003
- Reduction of diffraction effect of UV exposure on SU-8 negative thick photoresist by air gap eliminationMicrosystem Technologies, 2002
- Laser micromachining for manufacturing MEMS devices2001
- Recent developments in deep x-ray lithographyJournal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures Processing, Measurement, and Phenomena, 1998
- Wafer-to-wafer bonding for microstructure formationProceedings of the IEEE, 1998
- Excimer laser patterning of thick and thin films for high-density packaging1997
- Micromachining applications of a high resolution ultrathick photoresistJournal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures Processing, Measurement, and Phenomena, 1995
- Surface micromachiningJournal of Micromechanics and Microengineering, 1992