The practicality of TRIZ based conceptual solutions in solving tombstoning defects during SMD soldering
Authors:
- Issac Sing Sheng LimILIssac Sing Sheng Lim
- Edwin Chin Yau ChungECEdwin Chin Yau Chung
- Kenny Boon Thong TanKTKenny Boon Thong Tan
- Kok Soo TeohKTKok Soo Teoh
- 1 November 2015
- journal article
- Published by Elsevier in Chemical Engineering Research and Design
- Vol. 103, 123-129
Abstract
No abstract availableKeywords
This publication has 3 references indexed in Scilit:
- Eco-Efficient Product Design Using Theory of Inventive Problem Solving (TRIZ) PrinciplesAmerican Journal of Applied Sciences, 2010
- Product EngineeringChemical Engineering Research and Design, 2006
- Dynamic behavior of SMT chip capacitors during solder reflowIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1990