Capacitive microphone with a surface micromachined backplate using electroplating technology
Authors:
- J. BergqvistJBJ. Bergqvist
- J. GobetJGJ. Gobet
- 1 June 1994
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in Journal of Microelectromechanical Systems
- Vol. 3 (2) , 69-75
Abstract
No abstract availableThis publication has 16 references indexed in Scilit:
- A fully integrated surface micromachined magnetic microactuator with a multilevel meander magnetic coreJournal of Microelectromechanical Systems, 1993
- A new condenser microphone with a p+ silicon membraneSensors and Actuators A: Physical, 1992
- A silicon condenser microphone with structured back plate and silicon nitride membraneSensors and Actuators A: Physical, 1992
- Fabrication of silicon condenser microphones using single wafer technologyJournal of Microelectromechanical Systems, 1992
- A low cost monolithic accelerometer; product/technology update1992
- An integrated air-gap-capacitor pressure sensor and digital readout with sub-100 attofarad resolutionJournal of Microelectromechanical Systems, 1992
- Acoustic sensorsSensors and Actuators A: Physical, 1991
- A new condenser microphone in siliconSensors and Actuators A: Physical, 1990
- Movable Microstructures Manufactured by the LIGA Process as Basic Elements for Microsystems1990
- A subminiature condenser microphone with silicon nitride membrane and silicon back plateThe Journal of the Acoustical Society of America, 1989