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Ultrasonic Bonds for Use at Liquid-Helium Temperatures
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Ultrasonic Bonds for Use at Liquid-Helium Temperatures
Ultrasonic Bonds for Use at Liquid-Helium Temperatures
Authors:
ML
Moises Levy
Moises Levy
IR
Isadore Rudnick
Isadore Rudnick
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1 April 1962
journal article
Published by
Acoustical Society of America (ASA)
in
The Journal of the Acoustical Society of America
Vol. 34
(4)
,
520
DOI:
10.1121/1.1918162
Abstract
A process is described for sealing quartz crystals to metals with epoxy resin which has proven to be very dependable for low-temperature work.
Keywords
ULTRASONIC BONDS
USE
LIQUID HELIUM TEMPERATURES
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