Characterization of Particle Morphology and Rheological Behavior in Solder Paste

Authors:

JEJ. Evans
J. Evans
JBJ. Beddow
J. Beddow

Publisher website

1 June 1987

journal article
Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology

Vol. 10 (2) , 224-231
DOI:10.1109/tchmt.1987.1134725

Abstract

No abstract available

Keywords

This publication has 2 references indexed in Scilit:

Factors influencing the quality of solder powder used in solder pastes for thick film circuits, printed circuitboards and the electronics industry in general
Powder Technology, 1983
Morphological fourier descriptors
Powder Technology, 1982