Fatigue life evaluation of wire bonds in LED packages using numerical analysis
Authors:
- Sung-Uk ZhangSung-Uk Zhang
- Bang Weon LeeBLBang Weon Lee
- 1 December 2014
- journal article
- Published by Elsevier in Microelectronics Reliability
- Vol. 54 (12) , 2853-2859
Abstract
No abstract availableThis publication has 5 references indexed in Scilit:
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