Microstructural characterization and electrochemical behavior of nano/ ultrafine grained pure copper through constrained groove pressing (CGP)
Authors:
- Ahmad KeyvaniAKAhmad Keyvani
- Majid NaseriMNMajid Naseri
- Omid ImantalabOIOmid Imantalab
- Davood GholamiDGDavood Gholami
- Kazem BabaeiKBKazem Babaei
- Arash Fattah-AlhosseiniAFArash Fattah-Alhosseini
Open Access
- 1 March 2021
- journal article
- research article
- Published by Elsevier in Journal of Materials Research and Technology
- Vol. 11, 1918-1931
Abstract
No abstract availableKeywords
Funding Information
- Iran National Science Foundation (95841923)
This publication has 61 references indexed in Scilit:
- Constrained groove pressing of low carbon steel: Nano-structure and mechanical propertiesMaterials Science and Engineering: A, 2010
- Experimental and finite element investigation of semi-constrained groove pressing processMaterials & Design (1980-2015), 2010
- Corrosion behavior of copper alloys in chloride mediaMaterials & Design (1980-2015), 2009
- The effects of intermediate and post-annealing phenomena on the mechanical properties and microstructure of constrained groove pressed copper sheetMaterials Science and Engineering: A, 2009
- Ultrafine-grained structure development and deformation behavior of aluminium processed by constrained groove pressingMaterials Science and Engineering: A, 2009
- Nanoscaled structure of a Cu–Fe composite processed by high-pressure torsionMaterials Science and Engineering: A, 2005
- Microstructural evolution in commercial purity aluminum during high-pressure torsionMaterials Science and Engineering: A, 2005
- Microstructure of ECAP severely deformed iron and its mechanical propertiesMaterials Science and Engineering: A, 2004
- Constrained groove pressing and its application to grain refinement of aluminumMaterials Science and Engineering: A, 2002
- Observations and issues on mechanisms of grain refinement during ECAP processMaterials Science and Engineering: A, 2000