Synergistic Influence of Cu Intercalation on Electronic and Thermal Properties of n-Type CuxBi2Te2.7Se0.3 Polycrystalline Alloys
- 25 January 2019
- journal article
- research article
- Published by Springer Nature in Journal of Electronic Materials
- Vol. 48 (4) , 1951-1957
Abstract
No abstract availableKeywords
Funding Information
- Samsung (SRFC-MA1701-05)
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