An ultrafast IR thermography system for transient temperature detection on electronic devices
- 1 March 2014
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- No. 10652221,p. 80-84
Abstract
This paper presents a new Infrared thermography system for thermal characterization of semiconductor electronic devices in transient and steady-state applications. The developed set-up is based on an IR camera having a 100Hz frame-rate at full-frame and a focal plane array of 640×512 InSb sensors. In order to extend the dynamic capabilities of the system a synchronization network generates timing signals to drive the experiment and trigger the IR-camera in an equivalent-time acquisition mode, up to 1MHz equivalent bandwidth. Moreover the proposed synchronized solution is able to detect thermal maps in a non-repetitive, single event, experiment. To prove the effectiveness of the proposed IR system, thermal measurements are presented on commercial Power-MOSFET, during short-circuit (SC) tests, and Power Schottky diode in unclamped inductive switching (UIS) test.Keywords
This publication has 11 references indexed in Scilit:
- Electro-thermal characterization of AlGaN/GaN HEMT on Silicon Microstrip TechnologyMicroelectronics Reliability, 2011
- Nanosecond transient thermoreflectance imaging of snapback in semiconductor controlled rectifiers2011
- Analysis of large area Trench-IGBT current distribution under UIS test with the aid of lock-in thermographyMicroelectronics Reliability, 2010
- Detection of localized UIS failure on IGBTs with the aid of lock-in thermographyMicroelectronics Reliability, 2008
- An equivalent time temperature mapping system with a 320×256pixels full-frame 100kHz sampling rateReview of Scientific Instruments, 2007
- Fast transient infrared thermal analysis of smart Power MOSFETS in permanent short circuit operation2006
- Thermal characterisation of power devices during transient operationMicroelectronics Journal, 2006
- Noncontact transient temperature mapping of active electronic devices using the thermoreflectance methodIEEE Transactions on Components and Packaging Technologies, 2005
- Reliability enhancement with the aid of transient infrared thermal analysis of smart Power MOSFETs during short circuit operationMicroelectronics Reliability, 2005
- Temperature variation mapping of a microelectromechanical system by thermoreflectance imagingIEEE Electron Device Letters, 2005