Characterization of Interconnects on Multilayer High Frequency PCB for D- Band
Authors:
- 1 March 2020
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- p. 1-5
Abstract
The paper presents the characterization of interconnects for D-band on multilayer high frequency PCBs. The losses demonstrated at 150 GHz for a microstrip line, a coplanar waveguide and a single flip-chip transition are 1.9 dB/cm, 1.8 dB/cm and 0.3 dB (for 60 µm bumps), respectively. The applicability of multilayer high frequency PCB technology as a low cost integration platform for D-band is proven.Keywords
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