A 77GHz automotive radar receiver in a wafer level package
- 1 June 2012
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- No. 15292517,p. 511-514
Abstract
In this paper, a 77-GHz radar receiver is presented, which comes in a wafer level package and thus eliminates the need for wire bonding yielding significant cost reduction. The high integration level available in the productive Silicon-Germanium (SiGe) technology used in this paper allows for implementation of in-system monitoring of the receiver conversion parameters. This facilitates the realization of ISO 26262 compliant radar sensors for automotive safety applications.Keywords
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