Thixotropy flow behaviour of solder and conductive adhesive pastes
- 1 October 2004
- journal article
- Published by Springer Nature in Journal of Materials Science: Materials in Electronics
- Vol. 15 (10) , 677-683
Abstract
No abstract availableKeywords
This publication has 13 references indexed in Scilit:
- Correlation of solder paste rheology with computational simulations of the stencil printing processSoldering & Surface Mount Technology, 2002
- Transient phenomena in thixotropic systemsJournal of Non-Newtonian Fluid Mechanics, 2002
- Understanding the process window for printing lead-free solder pastesIEEE Transactions on Electronics Packaging Manufacturing, 2001
- Thixotropic rheology of semisolid metal suspensionsJournal of Materials Processing Technology, 2001
- Time dependent viscosity of concentrated alumina suspensionsColloids and Surfaces A: Physicochemical and Engineering Aspects, 1999
- Time-Dependent Rheological Properties of Semi-Solid Metal AlloysMechanics of Time-Dependent Materials, 1999
- A rheological model for lithium lubricating greaseTribology International, 1998
- Rheological characterization of solder pastes for surface mount applicationsIEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B, 1997
- Thixotropy—a reviewJournal of Non-Newtonian Fluid Mechanics, 1997
- Rheological characterization of solder pastesJournal of Electronic Materials, 1994