Si/SiGe epitaxial-base transistors. II. Process integration and analog applications

Authors:
  • JCJ.H. Comfort
    J.H. Comfort
  • JCJ.D. Cressler
    J.D. Cressler
  • ECE.F. Crabbe
    E.F. Crabbe
  • JSJ.Y.-C. Sun
    J.Y.-C. Sun
  • BMB.S. Meyerson
    B.S. Meyerson
  • TTT. Tice
    T. Tice

Abstract
For pt. I, see ibid., vol. 3, p. 455-68 (1995). This part focuses on process integration concerns, first described in general terms and then detailed through an extensive review of both simple non-self-aligned device structures and more complex self-aligned device structures. The extension of SiGe device technology to high levels of integration is then discussed through a detailed review of a full SiGe HBT BiCMOS process. Finally, analog circuit design is discussed and concluded, with a description of a 12-bit Digital-to-Analog Converter presented to highlight the current status of SiGe technology.

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