Measurements of mechanical coupling of non-curing high performance thermal interface materials
Authors:
- M.B. SternMSM.B. Stern
- G. JhotyGJG. Jhoty
- D. KearnsDKD. Kearns
- B. OngBOB. Ong
- 6 May 2006
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- p. 37-41
Abstract
No abstract availableKeywords
This publication has 3 references indexed in Scilit:
- Four decades of research on thermal contact, gap, and joint resistance in microelectronicsIEEE Transactions on Components and Packaging Technologies, 2005
- Evaluation of high performance thermal greases for CPU package cooling applications2005
- Improving accuracy and flexibility of ASTM D 5470 for high performance thermal interface materials2003