Effect of thermo-mechanically induced microstructural coarsening on the evolution of creep response of SnAg-based microelectronic solders
Authors:
- I. DuttaIDI. Dutta
- 1 November 2005
- journal article
- Published by Elsevier in Materials Science and Engineering: A
- Vol. 410-411, 48-52
Abstract
No abstract availableKeywords
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