Taguchi design of experiment for wafer bumping by stencil printing
Authors:
- J.H. LauJLJ.H. Lau
- C. ChangCCC. Chang
- 1 July 2000
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Electronics Packaging Manufacturing
- Vol. 23 (3) , 219-225
Abstract
No abstract availableKeywords
This publication has 4 references indexed in Scilit:
- Development of ball bump forming technology using solder paste and new simplified CSP2002
- Reliability and process characterization of electroless Nickel-Gold/Solder flip chip interconnect technology2002
- Stencil printing process development for low cost flip chip interconnect2002
- Handbook of Fine Pitch Surface Mount Technology1994