Chemically enhanced focused ion beam micromachining of copper
Authors:
- 1 November 2001
- journal article
- Published by American Vacuum Society in Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures Processing, Measurement, and Phenomena
- Vol. 19 (6) , 2539-2542
Abstract
Chemically enhanced focused ion beam micromachining of thin film Cu on Si substrates has been investigated. Barrier layers and dielectric layers were considered as well. The gases investigated include the Cl containing examples of C2Cl4, C2H4Cl2, and CHCl2CCl3 as well as the oxygen containing gases ethanol, and methanol and water vapor. Crystallographic channeling effect results in nonuniform Cu milling, insufficient selectivity and poor end-point detection. However, the gases investigated were shown to enhance the milling homogeneity, improve the end-point detection, and provide higher selectivity. A Cu/SiO2 selectivity of greater than 4 was obtained when using ethanol as the etching gas.Keywords
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