Design and development of a new machine vision wire bonding inspection system
Authors:
- 24 May 2006
- journal article
- research article
- Published by Springer Nature in The International Journal of Advanced Manufacturing Technology
- Vol. 34 (3-4) , 323-334
Abstract
No abstract availableKeywords
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- INSPAD: a system for automatic bond pad inspectionIEEE Transactions on Semiconductor Manufacturing, 1990
- A Threshold Selection Method from Gray-Level HistogramsIEEE Transactions on Systems, Man, and Cybernetics, 1979