Suppressing effect of 0.5wt.% nano-TiO2 addition into Sn–3.5Ag–0.5Cu solder alloy on the intermetallic growth with Cu substrate during isothermal aging
Author:
- L.C. TsaoLTL.C. Tsao
- 1 August 2011
- journal article
- Published by Elsevier in Journal of Alloys and Compounds
- Vol. 509 (33) , 8441-8448
Abstract
No abstract availableKeywords
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