Effect of 0.5 wt % Cu in Sn−3.5%Ag Solder Balls on the Solid State Interfacial Reaction with Au/Ni/Cu Bond Pads for Ball Grid Array (BGA) Applications
Authors:
- 29 March 2005
- journal article
- research article
- Published by American Chemical Society (ACS) in Chemistry of Materials
- Vol. 17 (9) , 2223-2226
Abstract
No abstract availableKeywords
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