Experimental analysis and modeling of multi-chip IGBT modules short-circuit behavior

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Abstract
Considering the case of railway-traction applications, this paper proposes an extensive experimental characterization of multi-chip IGB-modules, combining fast-transient short-circuit electrical measurements with infrared thermal mapping under realistic operation-like working-conditions. Then, it presents the development of a comprehensive electro-thermal compact model of the multi-chip assembly, which accounts for all major functional and structural electro-thermal effects and which can be used in common circuit simulation environments with great flexibility. A selection of simulation examples demonstrates the usefulness of the model in extending and complementing the information that can be gained by experiment. The results provide precious information for a reliable application of these components.