Solder bridging test to evaluate the compatibility for fine‐pitch microsoldering

Authors:
  • TTTadashi Takemoto
    Tadashi Takemoto
  • TFTatsuya Funaki
    Tatsuya Funaki
  • MMMakoto Miyazaki
    Makoto Miyazaki
  • AMAkira Matsunawa
    Akira Matsunawa
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Abstract
Establishes a quantitative evaluation method on solder bridging in microsoldering using a printed wiring board with comb pattern conductors. Bridge tests were conducted by immersing the comb pattern board into a molten solder bath. The total length of solder bridge between conductors against the total length between conductors was measured as a measure of the occurrence of solder bridging. The occurrence of bridging depended on the number of immersions, flux activity including solid content, conductor spacing, solder bath temperature and solder composition. The increase in number of immersion enhanced bridging. The rosin flux without activators showed higher bridging than the activated flux. Sn‐37Pb solder showed lower bridging than Sn‐3.5Ag‐5Bi solder. Solder bridging was found to be closely correlated with wettability, therefore, the improvement of wettability could be effective to suppress solder bridging. The proposed method is believed to be suitable for the quantitative evaluation of solder bridging.

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