The effect of Pd and Cu in the intermetallic growth of alloy Au wire
Authors:
- 1 November 2003
- journal article
- Published by Springer Nature in Journal of Electronic Materials
- Vol. 32 (11) , 1182-1187
Abstract
No abstract availableKeywords
This publication has 2 references indexed in Scilit:
- Intermetallic growth of wire-bond at 175°C high temperature agingJournal of Electronic Materials, 2001
- Intermetallic formation in gold-aluminum systemsSolid-State Electronics, 1970