Modeling of intergranular thermal fatigue cracking of a lead-free solder joint in a power electronic module
Authors:
- Van-Nhat LeVLVan-Nhat Le
- Lahouari BenabouLBLahouari Benabou
- Quang-Bang TaoQTQuang-Bang Tao
- Victor EtgensVEVictor Etgens
- 1 February 2017
- journal article
- Published by Elsevier in International Journal of Solids and Structures
- Vol. 106-107, 1-12
Abstract
No abstract availableThis publication has 48 references indexed in Scilit:
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