C‐19 diacid‐based polyamides

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Abstract
The preparation and properties of polyamide hot‐melt adhesives derived from Koch C‐19 diacid are described. They are comparable to those of commercial C‐36 dimer acid‐based polyamides for bonding leather and metals and somewhat superior to those of polyamides made from C‐19 diacid derived from a hydroformylation process.

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