The interaction kinetics and compound formation between electroless NiP and solder
Authors:
- Chwan-Ying LeeCLChwan-Ying Lee
- Kwang-Lung LinKLKwang-Lung Lin
- 1 September 1994
- journal article
- Published by Elsevier in Thin Solid Films
- Vol. 249 (2) , 201-206
Abstract
No abstract availableThis publication has 17 references indexed in Scilit:
- Reaction processes between silver or zinc doped Pb–Sn solder and goldMaterials Science and Technology, 1992
- Wetting behaviour of eutectic tin/lead solder and fluxes on copper surfacesJournal of Materials Science, 1991
- Solder bumper formation using electroless plating and ultrasonic solderingIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1990
- Connection of VLSI chips to printed circuit board using stacked solder bumpsElectronics Letters, 1987
- Kinetics of intermetallic compound growth between nickel, electroless, Ni-P, electroless Ni-B and tin at 453 to 493 KJournal of Materials Science, 1987
- Solder Connections with a Ni BarrierIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1986
- Flip-chip bonding with solder dippingReview of Scientific Instruments, 1985
- Soldering technology — decade of developmentsInternational Materials Reviews, 1984
- Kinetics of interfacial reaction in bimetallic CuSn thin filmsActa Metallurgica, 1982
- On the Growth of Alloy Layer between Solid Copper and Liquid TinTransactions of the Japan Institute of Metals, 1972