Validation of methodology to determine the contact resistivity of ECA-based bonds grounded on end–contact resistance measurements using redundant and modified TLM test structures
- 5 September 2023
- journal article
- research article
- Published by Elsevier in Solar Energy Materials and Solar Cells
- Vol. 262
Abstract
No abstract availableKeywords
Funding Information
- Bundesministerium für Wirtschaft und Klimaschutz (03EE1005A, 03EE1014D)
This publication has 11 references indexed in Scilit:
- Contact resistivity of ECA bonded joints2021
- Limited by our limitationsPerspectives on Medical Education, 2019
- Accurate contact resistivity extraction on Kelvin structures with upper and lower resistive layersIEEE Transactions on Electron Devices, 2000
- Kelvin Test Structure Modeling of Metal-Silicide-Silicon ContactsMRS Proceedings, 1998
- Statistical modeling of transmission line model test structures. I. The effect of inhomogeneities on the extracted contact parametersIEEE Transactions on Electron Devices, 1990
- Statistical modeling of transmission line model test structures. II. TLM test structure with four or more terminals: a novel method to characterize nonideal planar contacts in presence of inhomogeneitiesIEEE Transactions on Electron Devices, 1990
- Metal/semiconductor contact resistivity and its determination from contact resistance measurementsMaterials Science Reports, 1988
- Obtaining the specific contact resistance from transmission line model measurementsIEEE Electron Device Letters, 1982
- Models for contacts to planar devicesSolid-State Electronics, 1972
- Contact Resistance and Contact ResistivityJournal of the Electrochemical Society, 1972