Interfacial Cracks in Ceramic‐to‐Metal Bonds under Transient Thermal Loads
Author:
- 1 December 1987
- journal article
- Published by Wiley in Journal of the American Ceramic Society
- Vol. 70 (12) , 855-859
Abstract
The effect of a transient thermal load on an interfacial edge crack and center crack between a ceramic‐to‐metal bond was analyzed with the use of fracture mechanics. The deformations of the crack and the strain energy release rate were calculated for the case of a ceramic layer of equal thickness to the metal, one with one‐tenth the thickness of the metal, and one with 10 times the thickness of the metal. It was determined that for an edge crack, under slow cooling conditions, the steady‐state value of G is the largest, and G is largest for equal thicknesses of ceramic and metal. For a center crack, a maximum transient G occurs which is larger than the steady‐state value and the strain energy release rate is smallest for equal thicknesses of ceramic and metal.Keywords
This publication has 8 references indexed in Scilit:
- Ceramic-to-Metal Bonding from a Fracture Mechanics Perspective1986
- Thermal Stresses in Annular Glass-to-Metal Seals Under Thermal ShockAIAA Journal, 1984
- Failure analysis of plasma-sprayed thermal barrier coatingsThin Solid Films, 1984
- Ceramic thermal barrier coatingsIndustrial & Engineering Chemistry Product Research and Development, 1984
- Estimating the Strength of Annular Glass-to-Metal Seals in Microelectronic Packages: An Experimental StudyIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1984
- Free edge thermal stress singularities in finite concentric cylindersComputers & Structures, 1984
- Effect of thermal cycling on ZrO2Y2O3 thermal barrier coatingsThin Solid Films, 1980
- Evaluation of stress intensity factors for bimaterial bodies using numerical crack flank displacement dataInternational Journal of Fracture, 1979