Coupling Effect of On-Chip Inductor With Variable Metal Width

Authors:

2 July 2007

journal article
Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Microwave and Wireless Components Letters

Vol. 17 (7) , 498-500
DOI:10.1109/lmwc.2007.899306

Abstract

This study proposes a proper layout of on-chip inductors to diminish the coupling effect in silicon-based technology. Keeping self inductance constant, the mutual inductance is measured to characterize coupling effect in three test keys. A layout with variable metal width of inductor is found to alleviate mutual inductance. Experiment results demonstrate the mutual inductance decreases 33.5% compared with standard layout. This information will be helpful in implementation of more than one inductor into radio frequency integrated circuits (RFICs).

Keywords

This publication has 15 references indexed in Scilit:

A micromachined CMOS distributed amplifier by CMOS compatible ICP deep-trench technology
IEEE Electron Device Letters, 2006
De-embedding transmission line measurements for accurate modeling of IC designs
IEEE Transactions on Electron Devices, 2006
Current reused LC VCOs
IEEE Microwave and Wireless Components Letters, 2005
Analytical Formula for Inductance of Metal of Various Widths in Spiral Inductors
IEEE Transactions on Electron Devices, 2004
A 5.7-GHz 0.18-μm CMOS gain-controlled differential LNA with current reuse for WLAN receiver
IEEE Microwave and Wireless Components Letters, 2003
On the design of RF spiral inductors on silicon
IEEE Transactions on Electron Devices, 2003
Improvement of the quality factor of RF integrated inductors by layout optimization
IEEE Transactions on Microwave Theory and Techniques, 2000
On-chip spiral inductors with patterned ground shields for Si-based RF ICs
IEEE Journal of Solid-State Circuits, 1998
FASTHENRY: a multipole-accelerated 3-D inductance extraction program
IEEE Transactions on Microwave Theory and Techniques, 1994
Design of Planar Rectangular Microelectronic Inductors
IEEE Transactions on Parts, Hybrids, and Packaging, 1974