Microelectronic package characterisation using scanning acoustic microscopy

This publication has 17 references indexed in Scilit:

• Advanced Acoustic Microimaging Using Sparse Signal Representation for the Evaluation of Microelectronic Packages
  IEEE Transactions on Advanced Packaging, 2006
• Resolution improvement of acoustic microimaging by continuous wavelet transform for semiconductor inspection
  Microelectronics Reliability, 2006
• Sparse Bayesian Learning for Basis Selection
  IEEE Transactions on Signal Processing, 2004
• High-resolution AMI technique for evaluation of microelectronic packages
  Electronics Letters, 2004
• Model-based estimation of ultrasonic echoes. Part II: Nondestructive evaluation applications
  IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control, 2001
• Nondestructive methodology for standoff height measurement of flip chip on flex (FCOF) by SAM
  IEEE Transactions on Advanced Packaging, 2001
• Blind Source Separation by Sparse Decomposition in a Signal Dictionary
  Neural Computation, 2001
• Atomic Decomposition by Basis Pursuit
  SIAM Review, 2001
• Sparse signal reconstruction from limited data using FOCUSS: a re-weighted minimum norm algorithm
  IEEE Transactions on Signal Processing, 1997
• Matching pursuits with time-frequency dictionaries
  IEEE Transactions on Signal Processing, 1993