Copper-based metallization and interconnects for ultra-large-scale integration applications

Authors:
  • TATerry L. Alford
    Terry L. Alford
  • LJLi Jian
    Li Jian
  • JMJames W. Mayer
    James W. Mayer
  • WSWang Shi-Qing
    Wang Shi-Qing

Abstract
No abstract available