Copper-based metallization and interconnects for ultra-large-scale integration applications
Authors:
- Terry L. AlfordTATerry L. Alford
- Li JianLJLi Jian
- James W. MayerJMJames W. Mayer
- Wang Shi-QingWSWang Shi-Qing
- 1 June 1995
- journal article
- Published by Elsevier in Thin Solid Films
- Vol. 262 (1)