Comparative study of parallel gap resistance welding joints between different interconnected foils and GaAs solar cells: Microstructure and thermal reliability
Authors:
- Yuhan DingYDYuhan Ding
- Xiaoran LiXLXiaoran Li
- Zhichao WangZWZhichao Wang
- Chen ShenCSChen Shen
- Min WangMWMin Wang
- Nannan ChenNCNannan Chen
- Lin WangLWLin Wang
- Wenlu ZhouWZWenlu Zhou
- Gang RuanGRGang Ruan
- Yan CaiYCYan Cai
- Bin QianBQBin Qian
- Xueming HuaXHXueming Hua
- 12 December 2023
- journal article
- research article
- Published by Elsevier in Journal of Manufacturing Processes
- Vol. 109, 89-99
Abstract
No abstract availableKeywords
Funding Information
- National Natural Science Foundation of China (U1937601)
- Science and Technology Commission of Shanghai Municipality (21PJ1405000)
This publication has 17 references indexed in Scilit:
- Intermetallic compounds in solar cell interconnections: Microstructure and growth kineticsSolar Energy Materials and Solar Cells, 2017
- Characterization of IMC layer and its effect on thermomechanical fatigue life of Sn–3.8Ag–0.7Cu solder jointsJournal of Alloys and Compounds, 2012
- Field failure mechanism study of solder interconnection for crystalline silicon photovoltaic moduleMicroelectronics Reliability, 2012
- Intermetallic Phase Growth and Reliability of Sn-Ag-Soldered Solar Cell JointsEnergy Procedia, 2012
- Durability of Pb‐free solder between copper interconnect and silicon in photovoltaic cellsProgress in Photovoltaics: Research and Applications, 2010
- A study of on-orbit spacecraft failuresActa Astronautica, 2009
- Space solar array reliability: A study and recommendationsActa Astronautica, 2008
- Grain Boundary Diffusion in Metals: Recent DevelopmentsMATERIALS TRANSACTIONS, 2003
- Diffusion barriers in thin filmsThin Solid Films, 1978
- Elasticity and Thermal Expansion of Germanium Between −195 and 275°CJournal of Applied Physics, 1953