Thermal conductivity of W–Cu composites at various temperatures
Authors:
- Young Do KimYKYoung Do Kim
- Nang Lyeom OhNONang Lyeom Oh
- Sung-Tag OhSOSung-Tag Oh
- In-Hyung MoonIMIn-Hyung Moon
- 1 December 2001
- journal article
- research article
- Published by Elsevier in Materials Letters
- Vol. 51 (5) , 420-424
Abstract
No abstract availableKeywords
This publication has 7 references indexed in Scilit:
- Densification behavior of mechanically alloyed W-Cu composite powders by the double rearrangement processScripta Materialia, 1998
- Thermal conductivity determinations of thermal barrier coatingsMaterials Science and Engineering: A, 1998
- Laser flash measurement of the phononic thermal diffusivity of glasses in the presence of ballistic radiative transferHigh Temperatures-High Pressures, 1997
- A Model for the Thermal Properties of Liquid-Phase Sintered CompositesMetallurgical Transactions A, 1993
- Activated Sintering of Tungsten-Copper Contact MaterialsPowder Metallurgy, 1979
- Thermal diffusivity of dispersed compositesJournal of Applied Physics, 1976
- Prediction of thermal conductivity and electrical resistivity of porous metallic materialsInternational Journal of Heat and Mass Transfer, 1973