RF Interconnection Design of Bump Bonding with a Dislocation Package Structure towards Electro-Optic Modulation Applications

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Abstract
Bonding technology can be an important component of packaging for photonic chips, such as electro-optic (EO) modulators and other active function devices. In general, an EO modulator chip can achieve a broader 3 dB EO bandwidth than its packaging device, as the packaging design and structure can technically limit modulation performance. Recently, bump bonding has been shown to be a good candidate for the EO interconnection technique, which has a higher transmission bandwidth than wire bonding. In this article, we propose a design for radio frequency (RF) interconnection of bump bonding with a dislocation packaging (BBDP) structure. Through simulation calculations and analysis, the proposed BBDP structure shows a 3 dB transmission bandwidth of approximately 145 GHz, which is 52.6% better than one using optimized wire-bonding structures (95 GHz). The proposed packaging structure presents an important alternative method for ultrahigh speed optical modulation applications.
Funding Information
  • SJTU-Pinghu Institute of Intelligent Optoelectronics (2022SPIOE103, 61775084, 62075088, U2330113, U2030103, U2230111, SKXRC202304, 2023A0505050159, 2021A0505030036, 2022A1515110970, 202201010654, 21622107, 21622403, 21623411)
  • National Natural Science Foundation of China (2022SPIOE103, 61775084, 62075088, U2330113, U2030103, U2230111, SKXRC202304, 2023A0505050159, 2021A0505030036, 2022A1515110970, 202201010654, 21622107, 21622403, 21623411)
  • NSAF (2022SPIOE103, 61775084, 62075088, U2330113, U2030103, U2230111, SKXRC202304, 2023A0505050159, 2021A0505030036, 2022A1515110970, 202201010654, 21622107, 21622403, 21623411)
  • Youth Talent Support Programme of Guangdong Provincial Association for Science and Technology (2022SPIOE103, 61775084, 62075088, U2330113, U2030103, U2230111, SKXRC202304, 2023A0505050159, 2021A0505030036, 2022A1515110970, 202201010654, 21622107, 21622403, 21623411)
  • Natural Science Foundation of Guangdong Province (2022SPIOE103, 61775084, 62075088, U2330113, U2030103, U2230111, SKXRC202304, 2023A0505050159, 2021A0505030036, 2022A1515110970, 202201010654, 21622107, 21622403, 21623411)
  • Fundamental and application foundation project of Guangzhou (2022SPIOE103, 61775084, 62075088, U2330113, U2030103, U2230111, SKXRC202304, 2023A0505050159, 2021A0505030036, 2022A1515110970, 202201010654, 21622107, 21622403, 21623411)
  • Fundamental Research Funds for the Central Universities (2022SPIOE103, 61775084, 62075088, U2330113, U2030103, U2230111, SKXRC202304, 2023A0505050159, 2021A0505030036, 2022A1515110970, 202201010654, 21622107, 21622403, 21623411)

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