A new on-wafer de-embedding technique for on-chip rf transmission line interconnect characterization
Authors:
- Y. TretiakovYTY. Tretiakov
- K. VaedKVK. Vaed
- W. WoodsWWW. Woods
- S. VenkatadriSVS. Venkatadri
- T. ZwickTZT. Zwick
- 1 January 2004
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- p. 69-72
Abstract
No abstract availableKeywords
This publication has 3 references indexed in Scilit:
- A calibrated lumped-element de-embedding technique for on-wafer RF characterization of high-quality inductors and high-speed transistorsIEEE Transactions on Electron Devices, 2003
- An improved de-embedding technique for on-wafer high-frequency characterization2002
- S-parameter-based IC interconnect transmission line characterizationIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1992