Effect of Density and Ambient Temperature on Coefficient of Thermal Conductivity of Heat-Insulated EPS and PU Materials for Food Packaging
Authors:
- 1 November 2013
- journal article
- Published by Trans Tech Publications, Ltd. in Applied Mechanics and Materials
- Vol. 469, 152-155
Abstract
Coefficient of thermal conductivity is an important index of performance evaluation of heat-insulated material. In order to provide theoretical reference basis for the selection of heat-insulated materials, we test the coefficient of thermal conductivity of polystyrene foamed plastic (EPS) and rigid polyurethane foam plastic (PU) in different densities at different ambient temperatures, and then determine the effect of material density and ambient temperature on the coefficient of thermal conductivity of food insulation packaging materials. According to the national standard GB/T10297-1998(Test method for thermal conductivity of nonmetal solid materials by hot-wire method), we test the coefficient of thermal conductivity of samples in different densities at different ambient temperatures. The result shows that at the same temperature, the coefficient of thermal conductivity increases first and then decrease with the increase of density. In the same density, the coefficient of thermal conductivity increases with the increase of ambient temperature.Keywords
This publication has 4 references indexed in Scilit:
- Thermal analysis of a low temperature storage unit using phase change materials without refrigeration systemInternational Journal of Refrigeration, 2012
- Assessment of technical and environmental performances of wheat‐based foams in thermal packaging applicationsPackaging Technology and Science, 2010
- Effect of cold chain temperature abuses on the quality of frozen watercress (Nasturtium officinale R. Br.)Journal of Food Engineering, 2009
- Practical mathematical model to predict the performance of insulating packagesPackaging Technology and Science, 2007