Production of Highly Homogeneous Si(100) Surfaces by H2O Etching: Surface Morphology and the Role of Strain

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Abstract
The etching of Si(100) surfaces in ultrapure water was studied with a combination of infrared spectroscopy (FTIR) and scanning tunneling microscopy (STM). While the FTIR results show that the initially rough H/Si(100) surface becomes highly homogeneous during etching, a phenomenon generally associated with surface smoothing, STM images reveal that the homogeneity is associated with the formation of well-defined etch hillocks. After many hours of etching, the resulting H-terminated surface is composed of stripes of atomically flat Si(100) terminated by etch hillocks bounded by {111}- and {110}-oriented microfacets. Polarization analysis of the Si−H stretching modes provides strong evidence for uniform dihydride-termination of the flat regions, with the narrow (∼25 Å) width of these stripes allowing for relaxation of steric strain between neighboring dihydrides. The unusual hill-and-valley etch morphology is attributed to the effects of steric strain on the reactivity of sites on the etched surface.

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