Understanding models of substrate behaviour for the routing of high I/O packages
Authors:
- P.J. PalmerPPP.J. Palmer
- D.J. WilliamsDWD.J. Williams
- 27 November 2002
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- p. 58-63
Abstract
No abstract availableKeywords
This publication has 3 references indexed in Scilit:
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- TECHNOLOGY TRENDS IN ELECTRONICS AND PHOTONICS, THEIR MODELING AND EFFECT ON MANUFACTURING AND ASSEMBLYJournal of Electronics Manufacturing, 1997
- Limitation of the signal pin density on wiring boardsIEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B, 1996