Interface characterization in electrodeposited Cu–Co multilayers
Authors:
- 1 May 1996
- journal article
- research article
- Published by AIP Publishing in Journal of Applied Physics
- Vol. 79 (9) , 6884-6889
Abstract
Multilayers of Cu–Co made by electrodeposition are characterized. The interface width and layer roughness are measured by the Fresnel technique in electron microscopy. It is shown that the quality of the interfaces is comparable to that of layers made by physical deposition techniques. By depositing the layers on a glass substrate, we also show that it is possible to measure the magnetoresistance of the multilayers without removing the substrate. The values obtained are discussed in relation to the roughness of the layers and the electrodeposition conditions.Keywords
This publication has 24 references indexed in Scilit:
- Magnetic investigation of electrodeposited inhomogeneous alloyed CuCo filmsPhysica Status Solidi (a), 1994
- Magnetoresistance in Co–Cu Alloy Films Formed by Electrodeposition MethodJapanese Journal of Applied Physics, 1994
- Dependence of giant magnetoresistance on grain size in Co/Cu multilayersPhysical Review B, 1994
- High-field polar MOKE magnetometry as a probe of interlayer exchange coupling in MBE-grown Co/Cu/Co(111) and Fe/Cr/Fe(001) wedged trilayersJournal of Applied Physics, 1994
- Accurate alignment of sets of imagesJournal of Microscopy, 1994
- Transmission Electron Microscopy Studies of NiFe/Cu/Co/Cu on Si.MRS Proceedings, 1993
- Oscillatory magnetic exchange coupling through thin copper layersPhysical Review Letters, 1991
- Electrodeposition and study of multilayered Co/Cu structuresJournal of Materials Chemistry, 1991
- Oscillations in exchange coupling and magnetoresistance in metallic superlattice structures: Co/Ru, Co/Cr, and Fe/CrPhysical Review Letters, 1990
- A TEM fresnel diffraction-based method for characterizing thin grain-boundary and interfacial filmsPhilosophical Magazine A, 1986