Electrodes for Ceramic Barium Titanate Type Semiconductors
Author:
- 1 June 1965
- journal article
- research article
- Published by AIP Publishing in Journal of Applied Physics
- Vol. 36 (6) , 2000-2001
Abstract
A variety of commonly used methods for making electrical connections to ceramic semiconductors were compared, with indium amalgam, electroless nickel, and ultrasonic soldering having the lowest resulting resistances. It is suggested that, because of its ease of application, ultrasonic soldering may be the best over-all choice.Keywords
This publication has 3 references indexed in Scilit:
- Processing of Positive Temperature Coefficient ThermistorsJournal of the American Ceramic Society, 1960
- Ohmic Contacts to Semiconducting CeramicsJournal of the Electrochemical Society, 1960
- New Low Contact Resistance ElectrodeJournal of Applied Physics, 1956