Effects of cooling rate on the microstructure and tensile behavior of a Sn-3.5wt.%Ag solder
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- 1 December 2003
- journal article
- research article
- Published by Springer Nature in Journal of Electronic Materials
- Vol. 32 (12) , 1414-1420
Abstract
No abstract availableKeywords
This publication has 14 references indexed in Scilit:
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