Effect of adhesive fillet geometry on bond strength between microelectronic components and composite circuit boards
Authors:
- Saeed AkbariSASaeed Akbari
- Amir NouraniANAmir Nourani
- Jan K. SpeltJSJan K. Spelt
- 1 August 2016
- journal article
- Published by Elsevier in Composites Part A: Applied Science and Manufacturing
- Vol. 87, 228-236
Abstract
No abstract availableKeywords
Funding Information
- Natural Sciences and Engineering Research Council of Canada
- BlackBerry
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